Liquid cooling is transforming data center thermal management by delivering reliable, high‑efficiency heat removal for demanding Artificial Intelligence (AI) and High‑Performance Computing (HPC) workloads. Engineered for uptime, cleanliness, and long‑term material compatibility, Saint-Gobain's liquid cooling solutions are built to perform in the most advanced digital environments.
Integrating seamlessly with evolving architectures, we support both direct‑to‑chip (D2C/DTC) and immersion cooling approaches, ensuring exceptional performance and protection through careful material selection and robust system design.
As an OCP Bronze Member, Saint-Gobain is actively engaged in the global community shaping the future of data center cooling, giving us early visibility into emerging standards and technologies driving high density and AI-focused infrastructure. Through the OCP Cooling Environments Project, which explores liquid cooling, immersion, cold plates, door heat exchangers, and heat reuse strategies, Saint-Gobain stays aligned with proven next generation thermal practices that address rising power density and sustainability expectations.
Saint-Gobain’s participation ensures we are not just following industry direction, but are actively contributing to the standards that will guide cooling innovation now and in the future.
Why Data Centers Choose Liquid Cooling
- Higher cooling efficiency: Liquids conduct heat significantly better than air.
- Greater compute density: Enables more processing power in less space.
- Lower energy use: Reduces reliance on fans, chillers, and air-handling units.
- Improved reliability: Maintains consistent temperatures to protect sensitive electronics.
How Does Liquid Cooling Work?
Supporting components such as tubing and hoses enable routing, seals prevent leaks, and filters maintain particulate and cleanliness control. Additional elements—such as quick disconnects, sensors, degassing features, and fluid service points—can be incorporated to enhance performance and serviceability.